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The US trademark RELIA-ULTRAFAST was filed as Word mark on 08/03/2007 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 77246983 |
| Application date | August 3, 2007 |
| Publication date | January 29, 2008 |
Trademark owner
8248 Randolph Road NE
98837 Moses Lake
US
98837 Moses Lake
US
Trademark representatives
goods and services
1
Chemicals for use in high speed electrochemical metal plating process to produce thick copper interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of chemicals in high speed plating of interconnects
ID: 1377246983