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The US trademark XSEED was filed as Word mark on 06/18/2007 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 12/27/2011.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Word mark |
| File reference | 77208939 |
| Register number | 4077363 |
| Application date | June 18, 2007 |
| Publication date | August 5, 2008 |
| Entry date | December 27, 2011 |
Trademark owner
8755 W. HIGGINS ROAD
60631 CHICAGO
US
60631 CHICAGO
US
Trademark representatives
goods and services
9
Printed circuit boards; integrated circuits; semiconductor devices; printed circuit board substrates; materials for use in manufacturing printed circuit boards, printed circuit board substrates, integrated circuits, semiconductor devices, and embedded printed circuit board material, namely, static voltage regulators and voltage surge protectors; embedded printed circuit board materials; materials for discharge protection and overvoltage protection, namely, static voltage regulators and voltage surge protectors
17
Dielectric materials, namely, conductive insulating polymers; materials for electrostatic and overvoltage protection, namely, insulating dielectric materials; materials for use in manufacturing printed circuit boards, integrated circuits, semiconductor devices and embedded printed circuit boards, namely, insulating dielectric materials
42
Design and engineering services for others in the field of dielectric materials and regarding the manufacture of printed circuit boards, integrated circuits, and semiconductor devices
ID: 1377208939