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The US trademark CORECLAD was filed as Word mark on 05/09/2007 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 77176723 |
| Application date | May 9, 2007 |
| Publication date | October 30, 2007 |
Trademark owner
3800 West 143rd Street
44111 Cleveland
US
44111 Cleveland
US
Trademark representatives
goods and services
9
Printed circuit boards; and chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors, namely, dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuits
ID: 1377176723