IDI COMPOSITES INTERNATIONAL THERMOSET MOLDING COMPOUNDS Logo (USPTO, 04/19/2007)
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The US trademark IDI COMPOSITES INTERNATIONAL THERMOSET MOLDING COMPOUNDS was filed as Word and figurative mark on 04/19/2007 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 01/22/2008.
The current status of the mark is "CANCELLED - SECTION 8".
Trademark form | Word and figurative mark |
File reference | 77160405 |
Register number | 3371857 |
Application date | April 19, 2007 |
Publication date | November 6, 2007 |
Entry date | January 22, 2008 |
ID: 1377160405