TELEOPTIX

USPTO USPTO 2006 CANCELLED - SECTION 8

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The US trademark TELEOPTIX was filed as Word mark on 11/28/2006 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 10/21/2008. The current status of the mark is "CANCELLED - SECTION 8".

Trademark Details Last update: August 10, 2019

Trademark form Word mark
File reference 77052445
Register number 3518819
Application date November 28, 2006
Publication date August 5, 2008
Entry date October 21, 2008

Trademark owner

Via Guido Rossa, 20
20040 Cornate d'Adda (MI)
IT

Trademark representatives

goods and services

9 Electronic and optical instruments, components, devices, and systems for telecommunication, in particular in military, energy and transportation industry, namely, high frequency modules and transceivers for wireless applications, Synchronous Digital Hierarchy (SDH) high linearity up-and-down converters, Synchronous Digital Hierarchy (SDH) high power transmitter modules, Synchronous Digital Hierarchy (SDH) and Plesiochronous Digital Hierarchy (PDH) equipment, namely, Synchronous Digital Hierarchy (SDH) and Plesiochronous Digital Hierarchy (PDH) electronic and optical modules and tranceivers for wireless applications; systems and components for radio and optical fiber transmission, namely, high capacity optical transmitters, receivers, modules and transceivers for optical fiber transmission systems, active optical components, passive optical components and modules, Erbium Doped Fiber Amplifier (EDFA) and optical amplifiers, fiber optic based components
38 Telecommunication access services
42 Engineering services, namely, engineering services for telecommunication apparatuses and systems, in particular in military, energy and transportation industry, design and engineering services to develop projects and manufacturing of wireless high frequency systems and optical fiber systems; engineering services for designing and manufacturing of substrates such as ceramics and High Frequency (HF) laminates, Surface Mounting Device (SMD) and die attachment, such as brazing, reflow and attachment technologies and materials, interconnection technologies, such as connectorization, soldering, wire and ribbon bonding, fiber splicing and recoating, package sealing; engineering services for testing wireless high frequency systems and components thereof; engineering services for testing optical high capacity fiber optic systems and components thereof

ID: 1377052445