R/FLEX OPAL

USPTO USPTO 2006 ABANDONED - NO STATEMENT OF USE FILED

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The US trademark R/FLEX OPAL was filed as Word mark on 09/21/2006 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".

Trademark Details Last update: May 24, 2018

Trademark form Word mark
File reference 77003893
Application date September 21, 2006
Publication date April 3, 2007

Trademark owner

Suite 410
60712 Lincolnwood
US

Trademark representatives

goods and services

17 Circuit materials, namely, circuit laminates and cover films for use in manufacturing electronic circuitry; circuit materials, namely, laminates used in the production of flexible, printed circuits in a sheet or roll form

ID: 1377003893