HY-BOND Logo (USPTO, 10/16/2003)
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The US trademark HY-BOND was filed as Figurative mark on 10/16/2003 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Figurative mark |
| File reference | 76556100 |
| Application date | October 16, 2003 |
Trademark owner
11 Kamitakamatsu-cho, Fukuine
Higashiyama-ku, Kyoto 605
JP
Higashiyama-ku, Kyoto 605
JP
Trademark representatives
goods and services
5
Dental Material-namely, Dental Cement for Bonding Purposes
ID: 1376556100