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The US trademark E-PASSIVE INTERPOSER was filed as Word mark on 11/27/2001 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word mark |
| File reference | 76341620 |
| Application date | November 27, 2001 |
Trademark owner
1-1, Kamikodanaka, 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa-ken
JP
Kawasaki-shi, Kanagawa-ken
JP
Trademark representatives
goods and services
9
SEMICONDUCTOR SUBSTRATES; POLYAMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMICONDUCTORS; SEMICONDUCTOR CHIP PACKAGES; INTERPOSERS FOR SEMICONDUCTORS; PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS, CERAMIC PACKAGES AND SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS AND PRINTED CIRCUITS
ID: 1376341620