BLUELINE Logo (USPTO, 02/22/2001)
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The US trademark BLUELINE was filed as Word and figurative mark on 02/22/2001 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word and figurative mark |
| File reference | 76214446 |
| Application date | February 22, 2001 |
| Publication date | July 9, 2002 |
Trademark owner
Suite 150
02035 Foxborough
US
02035 Foxborough
US
Trademark representatives
goods and services
1
Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies
6
industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies
ID: 1376214446