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The US trademark BOND LAB was filed as Word mark on 06/01/2000 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 05/11/2004.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Word mark |
| File reference | 76058924 |
| Register number | 2841869 |
| Application date | June 1, 2000 |
| Entry date | May 11, 2004 |
Trademark owner
P.O. BOX 1013
54016 HUDSON
US
54016 HUDSON
US
Trademark representatives
goods and services
40
Custom manufacture of adhesives
42
Adhesive testing and adhesive process development
ID: 1376058924