MULTICORE SOLDAPRO ORACLE

USPTO USPTO 1999 ABANDONED - AFTER INTER-PARTES DECISION

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The US trademark MULTICORE SOLDAPRO ORACLE was filed as Word mark on 03/18/1999 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - AFTER INTER-PARTES DECISION".

Trademark Details Last update: May 10, 2018

Trademark form Word mark
File reference 75662907
Application date March 18, 1999
Publication date July 4, 2000

Trademark owner

Hemel, Hempstead
Hertfordshire, HP2 4 RQ
GB

Trademark representatives

goods and services

9 Electronic data-logger device for measuring temperature versus time of printed circuit boards during the assembly process, and fittings therefor

ID: 1375662907