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The US trademark SHO-BOND was filed as Word mark on 04/20/1998 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - AFTER EX PARTE APPEAL".
| Trademark form | Word mark |
| File reference | 75470750 |
| Application date | April 20, 1998 |
Trademark owner
3-18, Kanda-Nishiki-cho
Chiyoda-ku, Tokyo
JP
Chiyoda-ku, Tokyo
JP
Trademark representatives
goods and services
1
Resin adhesives for repairing cracks in concrete structures, adhesives for use in the construction industry
ID: 1375470750