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The US trademark MULTILEVEL MODULE was filed as Word mark on 04/11/1997 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 75273252 |
| Application date | April 11, 1997 |
| Publication date | September 29, 1998 |
Trademark owner
2975 Stender Way
95054 Santa Clara
US
95054 Santa Clara
US
Trademark representatives
goods and services
9
integrated circuits and printed circuit boards
16
printed materials, namely, informational pamphlets, operating manuals, user guides and informational brochures about hardware modules for use with printed circuit boards
ID: 1375273252