HY-BOND Logo (USPTO, 08/16/1993)
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The US trademark HY-BOND was filed as Figurative mark on 08/16/1993 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 06/21/1994.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Figurative mark |
| File reference | 74425256 |
| Register number | 1840278 |
| Application date | August 16, 1993 |
| Publication date | March 29, 1994 |
| Entry date | June 21, 1994 |
Trademark owner
11 Kamitakamatsu-cho, Fukuine
Higashiyama-ku, Kyoto 605
JP
Higashiyama-ku, Kyoto 605
JP
Trademark representatives
goods and services
5
dental cement for bonding purposes
ID: 1374425256