EPOXY BOND Logo (USPTO, 06/04/1991)
USPTOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The US trademark EPOXY BOND was filed as Word and figurative mark on 06/04/1991 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word and figurative mark |
| File reference | 74172859 |
| Application date | June 4, 1991 |
Trademark owner
21 Jalan Gelenggang, Damansara Heights
50490 Kuala Lumpur
MY
50490 Kuala Lumpur
MY
Trademark representatives
goods and services
1
adhesives for industrial purposes
ID: 1374172859