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The US trademark ASSEMBLY TECHNOLOGIES was filed as Word mark on 03/16/1990 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word mark |
| File reference | 74049649 |
| Application date | March 16, 1990 |
Trademark owner
795 Horsham Road
19044 Horsham
US
19044 Horsham
US
Trademark representatives
goods and services
7
automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices
9
automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices
37
maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices
ID: 1374049649