SOLDER SIGNATURE

USPTO USPTO 1990 ABANDONED - NO STATEMENT OF USE FILED

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The US trademark SOLDER SIGNATURE was filed as Word mark on 03/27/1990 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".

Trademark Details Last update: April 23, 2018

Trademark form Word mark
File reference 74043162
Application date March 27, 1990
Publication date October 30, 1990

Trademark owner

1530 O'Brien Drive
94025 Menlo Park
US

Trademark representatives

goods and services

9 apparatus for displaying the profile of processes involving fusion of metals, plastics, heat-recoverable plastics, and the curing of adhesives

ID: 1374043162