HYSOL Logo (USPTO, 08/05/1965)
USPTOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The US trademark HYSOL was filed as Word and figurative mark on 08/05/1965 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 09/06/1966.
The current status of the mark is "EXPIRED".
| Trademark form | Word and figurative mark |
| File reference | 72225030 |
| Register number | 814220 |
| Application date | August 5, 1965 |
| Entry date | September 6, 1966 |
Trademark owner
THE TRIAD, SUITE 200
19406 GULPH MILLS
US
19406 GULPH MILLS
US
Trademark representatives
goods and services
1
THERMOSETTING PLASTIC MATERIALS, E.G. IN THE FORM OF SHEETS, RODS AND TUBES, POWDERS AND LIQUIDS, EPOXY COMPOUNDS FOR POTTING OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS, MULTICOMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS, AND MOLDABLE SYNTHETIC CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD
9
ELECTRICAL INSULATING MATERIALS-NAMELY, THERMOSETTING RESINS USED AS ELECTRICAL INSULATING MATERIALS; EPOXY COMPOUNDS FOR POTTING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; THERMOSETTING POWDERS APPLIED TO PREHEATED OBJECTS BY DUSTING, BY DRY SPRAY PROCESSES AND BY FLUIDIZED BED PROCESSES; AND CLAMP-ON CASES AND RESIN FILLED CASES FOR IN-LINE, BRANCHED, AND BUTT SPLICES AND TERMINAL ENDS OF ELECTRICAL WIRES AND CABLES
19
RESIN BASED FABRICATING AND PATCHING MATERIALS, INCLUDING TWO-COMPONENT POLYMERIZABLE PATCHING MATERIAL FOR PLYWOOD AND THE LIKE, MULTICOMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS, AND MOLDABLE CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD
ID: 1372225030