TAIYO EUROPE Logo (EUIPO, 03/28/2023)
EUIPOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The Union trademark TAIYO EUROPE was filed as Figurative mark on 03/28/2023 at the European Union Intellectual Property Office.
It was registered as a trademark on 08/11/2023.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Tyres, tyre prints, snow chains, axles with or without wheels, steering wheels, radiators, exhausts, shock absorbers of land vehicles, also any other parts of land vehicles not classified in another category or division.
| Trademark form | Figurative mark |
| File reference | 018854760 |
| Application date | March 28, 2023 |
| Publication date | May 4, 2023 |
| Entry date | August 11, 2023 |
| Expiration date | March 28, 2033 |
Trademark owner
388 Ohkura, Ranzan-machi, Hiki-gun
355-0222 Saitama
JP
355-0222 Saitama
JP
Trademark representatives
Liebigstr. 39
80538 München
DE
goods and services
1
Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed
2
Dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink
17
Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; insulating materials; electrical insulating materials
ID: 11018854760