SARCON Logo (EUIPO, 11/17/2022)
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The Union trademark SARCON was filed as Figurative mark on 11/17/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 04/25/2023.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Letters presenting a special form of writing
| Trademark form | Figurative mark |
| File reference | 018795447 |
| Application date | November 17, 2022 |
| Publication date | January 16, 2023 |
| Entry date | April 25, 2023 |
| Expiration date | November 17, 2032 |
Trademark owner
FUJIPOLY Bldg., 21-1, Meieki 5-chome, Nakamura-ku,
450-0002 Nagoya-shi, Aichi
JP
450-0002 Nagoya-shi, Aichi
JP
Trademark representatives
Theresienstr. 6-8
80333 Munich
DE
goods and services
17
Thermal interface materials; adhesive thermal interface materials; elastic thermal interface materials; compressible thermal interface materials; electric insulating thermal interface materials; thermally conductive insulators; thermally conductive and electrically insulating pastes, adhesives, glues, films, greases, liquid gap filler, and gels; thermally conductive and electrically insulating flexible tubes and die cut gaskets; silicone for thermal conductivity; silicone rubber-based thermal interface materials; non-silicone based thermal interface materials; acrylic resin-based thermal interface materials; silicone rubber and non-silicone rubber in the form of sheets, pads, tubes, tapes, liquid gap filler, greases, gels, cases and gaskets to be used for thermal conductivity; acrylic resin in the form of sheets, pads, tubes, tapes, liquid gap filler, greases, gels, cases and gaskets to be used for thermal conductivity; two-part silicone-based gap filler for thermal conductivity; two-part non-silicone-based gap filler for thermal conductivity; two-part acrylic resin-based gap filler for thermal conductivity; synthetic rubber; raw or semi-worked rubber; electrical insulating and/or electrical conducting thermally conductive materials for use as a heat transfer material between heat generating devices and a heat sink in electronic devices; phase change materials
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| February 27, 2023 | Transfer / Change of address, Registered |
ID: 11018795447