KEKSE Wafers with filling Logo (EUIPO, 07/18/2022)
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The Union trademark KEKSE Wafers with filling was filed as Figurative mark on 07/18/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 12/13/2022.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Letters presenting a special form of writing
| Trademark form | Figurative mark |
| File reference | 018734164 |
| Application date | July 18, 2022 |
| Publication date | September 5, 2022 |
| Entry date | December 13, 2022 |
| Expiration date | July 18, 2032 |
Trademark owner
Za Soľnou 1064/11
914 41 Nemšová
SK
914 41 Nemšová
SK
Trademark representatives
Haštalská 1072/6 – Staré Město
110 00 Prague 1
CZ
goods and services
5
Dietetic and nutritional preparations; Dietetic confectionery adapted for medical purposes; Dietetic foods for use in clinical nutrition; Dietetic foods adapted for medical purposes; Dietetic foods adapted for infants; Dietary supplements and dietetic preparations
30
Gluten-free wafers; Milk-free and lactose-free wafers; Soya-free wafers; Egg-free wafers; Confectionery; Non-medicated confectionery for use as part of a calorie controlled diet; Low-carbohydrate confectionery; Low-carbohydrate wafers; Wafers with filling; Wafers
35
Internet retailing in relation to the following goods: Dietetic and nutritional preparations, Dietetic confectionery for therapeutic use, Dietetic foods for use in clinical nutrition, Dietetic foodstuffs adapted for medical use, Dietetic foods adapted for small children, Food supplements and dietetic substances; Internet retailing in relation to the following goods: Gluten-free wafers, milk-free wafers and lactose-free wafers, soya-free wafers, egg-free wafers, Confectionery, Confectionery without medicated ingredients included in low-caloric diets, low-carbohydrate confectionery, low-carbohydrate wafers, Wafers with filling, Semiconductor wafer, Cookies; Online wholesaling in relation to the following goods: Dietetic and nutritional preparations, Dietetic confectionery for therapeutic use, Dietetic foods for use in clinical nutrition, Dietetic foodstuffs adapted for medical use, Dietetic foods adapted for small children, Food supplements and dietetic substances; Online wholesaling in relation to the following goods: Gluten-free wafers, milk-free wafers and lactose-free wafers, soya-free wafers, egg-free wafers, Confectionery, Confectionery without medicated ingredients included in low-caloric diets, low-carbohydrate confectionery, low-carbohydrate wafers, Wafers with filling, Semiconductor wafer, Cookies; Retail services relating to goods in relation to the following goods: Dietetic and nutritional preparations, Dietetic confectionery for therapeutic use, Dietetic foods for use in clinical nutrition, Dietetic foodstuffs adapted for medical use, Dietetic foods adapted for small children, Food supplements and dietetic substances; Retail services relating to goods in relation to the following goods: Gluten-free wafers, milk-free wafers and lactose-free wafers, soya-free wafers, egg-free wafers, Confectionery, Confectionery without medicated ingredients included in low-caloric diets, low-carbohydrate confectionery, low-carbohydrate wafers, Wafers with filling, Semiconductor wafer, Cookies; Wholesale services in relation to: Dietetic and nutritional preparations, Dietetic confectionery for therapeutic use, Dietetic foods for use in clinical nutrition, Dietetic foodstuffs adapted for medical use, Dietetic foods adapted for small children, Food supplements and dietetic substances; Wholesale services in relation to in relation to the following goods: Gluten-free wafers, milk-free wafers and lactose-free wafers, soya-free wafers, egg-free wafers, Confectionery, Confectionery without medicated ingredients included in low-caloric diets, low-carbohydrate confectionery, low-carbohydrate wafers, Wafers with filling, Semiconductor wafer, Cookies
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| October 4, 2023 | Change Representative, Published |
ID: 11018734164