Absolics Logo (EUIPO, 06/28/2022)
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The Union trademark Absolics was filed as Figurative mark on 06/28/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 11/08/2022.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Letters presenting a special form of writing
| Trademark form | Figurative mark |
| File reference | 018723349 |
| Application date | June 28, 2022 |
| Publication date | August 1, 2022 |
| Entry date | November 8, 2022 |
| Expiration date | June 28, 2032 |
Trademark owner
3000 SKC Drive
30014 Covington
US
30014 Covington
US
Trademark representatives
Siegfriedstraße 8
80803 München
DE
goods and services
1
Chemicals for industrial purposes; chemicals for use in metal plating; chemical compositions for metal plating; copper material for glass penetrating electrode (chemicals) for electronic devices; copper material for electronic devices; chemicals for electronic devices; stripper for manufacture of semiconductor packages (delamination agent); electronic metal plating for manufacture of semiconductor packages; developer for manufacture of semiconductor packages (developing solution); photoresist for manufacture of semiconductor packages
9
Components for electric circuits; semiconductor package; printed circuit board; electronic circuit board; flexible circuit boards; electronic integrated circuits; integrated circuit package; integrated circuit module; 3D integrated circuit; large scale integrated circuits (LSI); electronic memory circuits; circuit boards provided with integrated circuits; semiconductor package and packaging shaped integrated circuit module; glass substrate for semiconductor; daughterboards; digital boards; motherboards; lead frames for semiconductors; memory modules; random access memory (RAM) module
21
Glass incorporating fine electrical conductors; semi-worked glass; glass incorporating fine electrical conductors [not for building]; Glass substrates incorporating fine electrical conductors [semi-worked glass not for building]; Glass substrates incorporating fine electrical conductors for use in micro-electro-mechanical systems (MEMS) [semi-worked glass not for building]; glass feedthrough for devices [semi-worked glass not for building]
35
Providing commercial information related to semiconductor packages; providing commercial information related to semiconductor packages through on-line media such as internet; providing commercial information related to substrate using glass incorporating fine electrical conductors; providing commercial information related to substrate using glass incorporating fine electrical conductors through on-line media such as internet; wholesale service of semiconductor packages; retail service of semiconductor packages; intermediary service of semiconductor packages; sales agency services for semiconductor packages; sales arranging of semiconductor packages; purchasing agency services for semiconductor packages; wholesale service of substrate using glass incorporating fine electrical conductors [semi-worked glass not for building]; retail service of substrate using glass incorporating fine electrical conductors [semi-worked glass not for building]
40
Service for providing finished products comprising customised semiconductors, semiconductor chips and integrated circuits; custom assembling service of circuit substrates and semiconductors; processing service of semiconductor equipment and components; processing of semiconductors; processing of semiconductor treatment; custom manufacture and assembling related to semiconductor components and integrated circuit; processing of semiconductor elements; processing of semiconductor etching; processing of components for manufacture of semiconductor
42
Designing of mechanic apparatus for manufacturing semiconductor; developing of fine pitch solder bumping technology; providing of semiconductor wafer bumping technology; providing of semiconductor packaging technology; consultancy related to integrated circuits; designing of semiconductors or integrated circuits; designing of semiconductors; designing of integrated circuits; research in the field of semiconductor design; research/design and testing related to semiconductor development; research related to semiconductors; consultancy related to semiconductor technology; consultancy related to semiconductor design; research in the field of semiconductor manufacture; service of designing integrated circuits; designing of electronic circuit substrates
ID: 11018723349