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The Union trademark TSMC FinFlex was filed as Word mark on 03/24/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 07/16/2022.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 018677458 |
| Application date | March 24, 2022 |
| Publication date | April 8, 2022 |
| Entry date | July 16, 2022 |
| Expiration date | March 24, 2032 |
Trademark owner
No.8, Li-hsin Road 6, Hsinchu Science Park
300096 Hsinchu
TW
300096 Hsinchu
TW
Trademark representatives
Kungsbroplan 3
112 27 Stockholm
SE
goods and services
40
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
42
Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| January 4, 2024 | Change Representative, Published | ||
| June 15, 2022 | Transfer / Change of address, Registered |
ID: 11018677458