WOLFSPEED LEADING THE PACK Logo (EUIPO, 03/24/2022)
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The Union trademark WOLFSPEED LEADING THE PACK was filed as Figurative mark on 03/24/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 07/27/2022.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Dogs, wolves, foxes #Heads of animals of Series I #Animals of Series I stylized
| Trademark form | Figurative mark |
| File reference | 018676771 |
| Application date | March 24, 2022 |
| Publication date | April 19, 2022 |
| Entry date | July 27, 2022 |
| Expiration date | March 24, 2032 |
Trademark owner
4600 Silicon Drive
27703 Durham
US
27703 Durham
US
Trademark representatives
Avenue des Arts 56
1000 Bruxelles
BE
goods and services
9
Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules
40
Customized materials assembly for others; custom manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; custom manufacture of transistors for others; custom manufacture of wireless communication components; custom manufacture of amplifiers for others; custom manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; custom manufacture of metal semiconductor field effect transistors (MESFETS) for others; custom manufacture of components formatted for the worldwide interoperability for microwave access standard for others; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information
42
Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices; technical support services, namely, providing technical advice related to the custom manufacture of semiconductor materials and devices
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| July 29, 2022 | Change Representative, Published |
ID: 11018676771