EUIPOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The Union trademark NaNoS was filed as Word mark on 11/09/2020 at the European Union Intellectual Property Office.
It was registered as a trademark on 04/07/2021.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 018335055 |
| Application date | November 9, 2020 |
| Publication date | December 22, 2020 |
| Entry date | April 7, 2021 |
| Expiration date | November 9, 2030 |
Trademark owner
2 Ilan Ramon Street
7403635 Ness Ziona
IL
7403635 Ness Ziona
IL
Trademark representatives
Via Collina, 36
00187 Roma
IT
goods and services
40
Custom additive manufacturing for others in the field of electronics; Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial micro electromechanical systems (MEMS), substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae printed circuit boards (PCB), antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like printed circuit boards PCB (SLP); Manufacture of hi-performance electronic devices for others, namely, fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), interposers - fabricated using 3D printers; Manufacturing services for others in the field of hi-performance electronic devices, namely, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae printed circuit boards PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like printed circuit boards PCB (SLP); Manufacturing services for others in the field of hi-performance electronic devices, namely, Fan-in/Fan-out AiP (InFO-AiP), package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), and interposers
ID: 11018335055