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The Union trademark waveSTRATE was filed as Word mark on 08/05/2020 at the European Union Intellectual Property Office.
It was registered as a trademark on 12/30/2020.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 018284927 |
| Application date | August 5, 2020 |
| Publication date | September 22, 2020 |
| Entry date | December 30, 2020 |
| Expiration date | August 5, 2030 |
Trademark owner
FUJIPOLY Bldg., 21-1, Meieki 5-chome, Nakamura-ku,
450-0002 Nagoya-shi, Aichi
JP
450-0002 Nagoya-shi, Aichi
JP
Trademark representatives
Theresienstr. 6-8
80333 Munich
DE
goods and services
17
Semi-worked plastic substances; semi-worked synthetic resins; semi-worked polymer resins; plastic semi-worked products; plastic material in the form of boards, sheets and plates [semi-finished products]; metalized plastic sheets for use in manufacture; laminated plastic materials for manufacture; fiber-reinforced plastic boards [semi-finished products]; synthetic resins, semi-processed; plastic substances, semi-processed; polymer films for use in manufacture; polymer films for use in the manufacture of electric/electronic circuits; semi-processed fluororesin substrates for use in electronic circuits and antennas; semi-processed fluoropolymer substrates for use in electronic circuits and antennas; materials for electronic circuits and antennas, namely, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for use in fabricating electronic circuits and antennas; pre-preg adhesive polymer film and bonding polymer film used for manufacturing electronic circuits; electronic/electrical circuit board materials having a lower dielectric constant; electronic/electrical circuit board materials having a lower dielectric dissipation factor; laminates comprising low-dielectric constant electrical/electronic circuit materials covered with copper foil, for use in fabricating electronic circuits; laminates in which one or both sides of low-dielectric dissipation factor electrical/electronic circuit materials are covered with a copper foil for fabricating electronic circuits
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| February 27, 2023 | Transfer / Change of address, Published | ||
| February 2, 2021 | Change Representative, Published |
ID: 11018284927