tsmc 3DFabric

EUIPO EUIPO 2020 Trademark registered

Protect this trademark from copycats!

With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.

The Union trademark tsmc 3DFabric was filed as Figurative mark on 08/04/2020 at the European Union Intellectual Property Office.
It was registered as a trademark on 12/10/2020. The current status of the mark is "Trademark registered".

Logodesign (Wiener Klassifikation)

#One circle #Rectangles #Several quadrilaterals juxtaposed, joined or intersecting #Quadrilaterals with dark surfaces or parts of surfaces #Other combinations of different geometrical figures, juxtaposed, joined or intersecting, combinations of more than two different geometrical figures #One line or one band #Horizontal lines or bands

Trademark Details Last update: February 9, 2024

Trademark form Figurative mark
File reference 018282562
Application date August 4, 2020
Publication date September 1, 2020
Entry date December 10, 2020
Expiration date August 4, 2030

Trademark owner

No.8, Li-hsin Road 6, Hsinchu Science Park
300096 Hsinchu
TW

Trademark representatives

Kungsbroplan 3 112 27 Stockholm SE

goods and services

9 Semiconductors, memory chips, wafers and integrated circuits
40 Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
42 Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits

Trademark history

Date Document number Area Entry
January 4, 2024 Change Representative, Published
June 15, 2022 Transfer / Change of address, Published
July 22, 2021 Transfer / Change of address, Published
July 21, 2021 Transfer / Change of address, Published

ID: 11018282562