Integrated Metal Substrate

EUIPO EUIPO 2019 Application refused

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The Union trademark Integrated Metal Substrate was filed as Word mark on 05/23/2019 at the European Union Intellectual Property Office. The current status of the mark is "Application refused".

Trademark Details Last update: December 12, 2019

Trademark form Word mark
File reference 018071221
Application date May 23, 2019

Trademark owner

3-10, Fukuura, Kanazawa-ku
Yokohama
JP

Trademark representatives

Leeuwenveldseweg 12 1382 LX Weesp NL

goods and services

9 Printed wiring boards; Printed circuit boards; Electronic circuit boards; Electrical circuit boards; Printed circuit boards incorporating integrated circuits; Circuit boards; Printed circuit boards incorporating electronic components mounting

ID: 11018071221