Microbond Logo (EUIPO, 03/18/2019)
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The Union trademark Microbond was filed as Figurative mark on 03/18/2019 at the European Union Intellectual Property Office. The current status of the mark is "Application refused".
Logodesign (Wiener Klassifikation)
#One line or one band #Wavy lines or bands, zigzag lines or bands #Letters or numerals forming some other geometrical figure #One letter #Letter 'M'
| Trademark form | Figurative mark |
| File reference | 018036742 |
| Application date | March 18, 2019 |
Trademark owner
Heraeusstr. 12-14
63450 Hanau
DE
63450 Hanau
DE
Trademark representatives
Heraeusstraße 12 - 14
63450 Hanau
DE
goods and services
1
Soldering agents; soldering preparations; soldering compositions; soldering pastes; soldering creams
6
Hard solder; soft solder; lead-free solder; soldering metals; soldering alloys; solder rods of metal; solder wires; solder wires with built-in flux; metals in powder form; solder powder; solder balls
ID: 11018036742