HITECH

EUIPO EUIPO 2018 Application withdrawn

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The Union trademark HITECH was filed as Word mark on 12/27/2018 at the European Union Intellectual Property Office. The current status of the mark is "Application withdrawn".

Trademark Details Last update: November 1, 2019

Trademark form Word mark
File reference 018004427
Application date December 27, 2018

Trademark owner

245 Freight Street
06702 Waterbury
US

Trademark representatives

Bedford House, John Street WC1N 2BF London GB

goods and services

1 Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; adhesives used in the assembly, maintenance and repair of electronics; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resin; adhesives, resins, epoxy and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; adhesives, resins, epoxy and unprocessed epoxy resins for use in the electronics industry

ID: 11018004427