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The Union trademark FORTIBOND was filed as Word mark on 03/07/2013 at the European Union Intellectual Property Office.
It was registered as a trademark on 07/30/2013.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 011633377 |
| Application date | March 7, 2013 |
| Publication date | April 22, 2013 |
| Entry date | July 30, 2013 |
| Expiration date | March 7, 2033 |
Trademark owner
245 Freight Street
06702 Waterbury
US
06702 Waterbury
US
Trademark representatives
Calle Zurbano 76, 7º dcha,
28010 Madrid
ES
goods and services
1
Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die (either with flip chip wafer bumping or wire bonded tipe), onto a variety of substrates, and hermetic/near hermetic packaging; Transferable films for wafer-to-wafer bonding, attachment of semiconductor die (either flip chip or wire bonded), onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes and inks for production of electrical and thermal interconnect lines and patterns, circuitry, pads; Printable pastes for via-fill applications; pastes and films for reflective layer printing or transfer
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| March 3, 2023 | Extension, Trade mark renewed | ||
| April 11, 2022 | Transfer / Change of address, Published | ||
| January 4, 2022 | Change Representative, Published | ||
| December 1, 2016 | Transfer / Change of address, Published | ||
| December 1, 2016 | Transfer / Change of address, Published | ||
| June 17, 2014 | Change Representative, Published | ||
| July 23, 2013 | Transfer / Change of address, Published |
ID: 11011633377