INFOMAX Logo (EUIPO, 03/23/2001)
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The Union trademark INFOMAX was filed as Figurative mark on 03/23/2001 at the European Union Intellectual Property Office. The current status of the mark is "Application withdrawn".
Logodesign (Wiener Klassifikation)
#Monograms formed of intertwined, overlapping or otherwise combined letters #Letter 'I' #Letter 'N'
| Trademark form | Figurative mark |
| File reference | 002145225 |
| Application date | March 23, 2001 |
| Publication date | February 10, 2003 |
Trademark owner
1F, No. 33 Hsin Tai Rd.
Chupei, Hsinchu Hsien
TW
Chupei, Hsinchu Hsien
TW
Trademark representatives
Helios Court
1 Bishop Square
AL10 9NE Hatfield
GB
goods and services
9
Electrical, electronic, optical and electro-optical devices and components; light emitting diodes, light emitting diode chips, light emitting diode wafers; optical equipment, apparatus and devices including optical transmitters, optical receivers, optical transceivers, optical communication laser diodes with sealing caps, optical communication O/E Modules, light emitting diodes for optical communication, light emitting diode modules for optical communication passive component modules, laser diode wafers, laser diode chips, laser diode modules, wavelength division multiplexers, multiplexers, optical subassembly, arrayed wave guides, adaptors and connectors of optical wave guides, optical wave guides, semiconductors, optical fibre grating, optical amplifier, optical communication active component modules, photodiodes, photodiode chips, photodiode wafers, photodiode modules, optical fibres, arrayed waveguide grating, optical pumping module; parts and fittings for the aforesaid goods
39
Packaging services for electronic and optical components and modules including circuit board chips and wafers; information and advisory and consultancy series in relation to the aforesaid
40
Construction of supports; housing and packaging for electronic and optical components and modules including circuit board chips and wafers; custom manufacture of supports, housing and packaging for electronic and optical components and modules including circuit board chips, wafers, optical communication process active modules and optical communication passive modules; custom manufacture of wafers; custom manufacture of electrical, electronic, optical and electro-optical devices and components; information and advisory and consultancy series in relation to the aforesaid \ \
42
Research and development services in the field of electrical, electronic, optical and electro-optical devices and components; design and testing services for scientific and measuring apparatus and instruments, including electrical, electronic, optical and electro-optical devices and components; design and testing of optical fibre components, including optical fibre components for communication; design and testing of wafers; design and testing services for optical communication components including optical communication components for communication; provision of information, namely scientific data; consulting services in the field of science and electronics; scientific data analysis; provision of information in the field of electronics and optical components and devices; consultancy and advisory services in relation to the foregoing
ID: 11002145225